It is hard see what is inside the wafer of an integrated circuit . When you see inside an IC their you will find a silicon chip in which all wire are interconnected . A team of researcher have recently discovered a way to capture image of circuit inside a chip,with the help of X-ray beam .They flash the beam of X-ray beam on the intel G3260 processor and were able to reconstruct the components like transistor , resistor and interconnection between them.The team says,” In near future this technique of capturing image inside chip could be extended to capture the higher resoultion image of interconnection .
This idea of observing what is inside the chip is useful in reverse engineering . Which helps to learn what other brand of electronics are implementing for their chip .
To make a 3D model the Intel G3260 processor’s —the team flashed beam of X-ray through the chip. The various circuit components like resistors,transistors and its connection copper wires scattered the light in different ways in all possible direction and cause constructive and destructive interference. Through This technique called X-ray ptychography, the team did this experiment with different angle with X-ray beam and collect the data and use this result to reconstruct chip’s internal structure.